MicroLens Array master manufactured by CEA-Leti is made of Si and SiO2.

Manufacturing is based on standard lithography associated to dry and wet etch to obtain the final shape on demande.

It is associated to specific design of customer, down to 2 µm microlenses without gap. It could cover surface from some micrometer to the full wafer. The technology used guarantee uniformity over the full wafer.

Substrate and surface

• 200 mm Si wafer
• Maximum Area : full wafer
• Minimum Area : /
• Material : Si and SiO2

Feature

• Minimum size
  • CD : 2 µm
  • Height : 1µm
  • Pitch : 2 µm
  • No gap
• Maximum size
  • CD = 100µm
  • Height : 5 µm
  • Pitch : 2 µm
  • Aspect ratio H/Pitch = 1/4
• Concave shape