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R2R assembly pilot line
Offering type
TECHNICAL SERVICE
Organisation name
VTT Technical Research Centre of Finland Ltd
Manufacturing pillar
R2R
Technology
[ASSEMBLY] Low mix assembly (SMD, bare die, foils)
Markets
Automotive
Imagers & Displays
Lighting
Security & Branding
Transportation
Offering description
R2R assembly pilot line for assembling SMD components on flexible low cost foil circuitry
Offering specifications
All process steps (dispensing, assembly and curing) on the same run
Stop and go type operation at individual process equipment
S2S operation possible with manual handling
Elite Dispenser DR-61 (Nordson DIMA)
Minimum repeatable dot size ~200µm for a silver epoxy
Process suitable for heat curable ICAs, ACA tools not available
Fuji NXT III for component placement, work area about 400-500*300mm (MD*TD)
Minimum component size 0402 (01005") and maximum throughput 27000 CPH
Offering Report
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