CEA-Leti have capability to perform NanoImprinting at wafer-scale.
The technology used to perform this replication is soft UV-NIL. It allows to pattern Si or glass wafer from a first master wafer and keep the same polarity. The associated materials and equipment allow to reach an high throughput of 60 wafers per hour.
Size of patterns replicated are from micrometers to nanometers. It is possible to replicate 2D shape, 3D shape or freeform with angle below 90°. The resist used for replication could be change to have the specific refractive index needed.