R2R assembly pilot line
VTT Technical Research Centre of Finland Ltd
[ASSEMBLY] Low mix assembly (SMD, bare die, foils)
Automotive Imagers & Displays Lighting Security & Branding Transportation

R2R assembly pilot line for assembling SMD components on flexible low cost foil circuitry

  • All process steps (dispensing, assembly and curing) on the same run
  • Stop and go type operation at individual process equipment
  • S2S operation possible with manual handling
  • Elite Dispenser DR-61 (Nordson DIMA)
  • Minimum repeatable dot size ~200µm for a silver epoxy
  • Process suitable for heat curable ICAs, ACA tools not available
  • Fuji NXT III for component placement, work area about 400-500*300mm (MD*TD)
  • Minimum component size 0402 (01005") and maximum throughput 27000 CPH