▪feasibility studies on new layer systems for specific applications
▪development of sputtering processes for functional layer systems
and single layers under near-real production conditions
▪small series production for market introduction of new products
▪adaptation and supply of key components (for example power supplies, pulse and control units, also as integrated packages) for example for modernizing or expanding existing production plants

multi-chamber in-line plant with:

▪ 8 process chambers which can be fitted with:
▫ 5 planar DMS systems, target length 900 mm
▫ 2 × 2 planar single magnetrons, target length 750 mm
▫ 1 rotatable cathode DMS system, target length 780 mm
▫ 2 inverted RF sputter-etchers, length 750 mm

▪ parallel and separately operable plant sides
(inkl. reversing chamber and transport in the clean room)

▪ coating area: 1200 x 600 mm^2

▪ 2 heating chambers

▪ base pressure: 2 × 10-6 mbar
▪ working pressure 10-4 … 10-2 mbar